Alchip Technologies, a leading provider of high-performance ASIC solutions, recently showcased its achievements and future plans at TSMC’s 2024 Technology Symposium exhibits in Santa Clara, CA, and Austin, TX. The company emphasized its advanced technology and chiplet design strategies.
At the event, Alchip highlighted its expertise in high-performance computing design and discussed successful ASIC projects. They showcased their full reticle size designs exceeding 800mm², built on cutting-edge FinFET technology. Additionally, Alchip engineers presented the company’s record-setting advanced package production achievements, including CoWoS® designs on advanced nodes, power levels surpassing 1000W, and large interposers and packages currently in production.
Alchip also emphasized its industry partnerships, such as its involvement in the TSMC Open Innovation Platform® (OIP) Value Chain Alliance (VCA) and 3DFabricTM Alliance. For more information on Alchip’s event participation, visit their Press Center on their website.
Established in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies Ltd. is a global provider of silicon design and production services for system companies developing complex ASICs and SoCs. The company offers faster time-to-market solutions for SoC design across mainstream and advanced process technologies. Alchip is known for its expertise in advanced 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management. Customers of Alchip include global leaders in AI, HPC/supercomputing, mobile phones, entertainment devices
