Alchip Technologies recently showcased their advanced technology and chiplet design plans at the TSMC 2024 North America Technology Symposium held in Santa Clara, CA and Austin, TX. The company will also be present at upcoming TSMC NA Technology Workshops in Boston, as well as Technology Symposiums in Europe, Taiwan, China, and Japan.
At their booth, Alchip highlighted their expertise in high-performance computing design and discussed their success across multiple complex projects. They shared details on their advanced package production, such as CoWoS® designs on cutting-edge FinFET technology and packages exceeding 70x80mm2 in production.
Alchip emphasized their industry partnerships, including membership with TSMC Open Innovation Platform® Value Chain Alliance and 3DFabricTM Alliance. The company has established itself as a high-performance ASIC leader through its advanced 2.5D/3DIC design capabilities, CoWoS/chiplet design expertise, and manufacturing management capabilities.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies is a global provider of silicon design and production services for system companies developing complex ASICs and SoCs. They offer faster time-to-market and cost-effective solutions for SoC design at both mainstream and advanced process technology nodes. Alchip serves customers in various industries, including AI, HPC/supercomputing, mobile phones, networking equipment, and more.
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